Samsung is predicted to develop the Flip Chip Ball Grid Array (FC-BGA) for Apple’s next-generation PC processors. The FC-BGA is the semiconductor substrate that connects the semiconductor chip to the main substrate.
According to the latest info, Samsung Electro-Mechanics is expected to develop the product by this year and Apple is expected to supply it. Samsung is taking part in the Apple PC processor M2 development project developed by Apple.
Samsung is reported to have supplied FC-BGA substitutes for the M1, which was first unveiled in November 2020. Apple began developing the M2 as soon as it introduced the M1. It is developing at least nine Mac PCs, including the M2, which is the successor to the M1.
Apple is expected to introduce the M2 processor in the first half of this year. And, Samsung Electro-Mechanics participated in the Apple M2 development project because it received high scores from high-spec suppliers for the M1 series. There are some companies that can reliably supply FC-BGA to Apple.
Samsung Electro-Mechanics is aggressively expanding its high value-added substrate business. It is expanding investments and focusing on keeping consumers safe from a supply crunch by 2027.
The company has invested KRW 1.3 trillion in package substation production facilities in a Vietnamese production subsidiary late last year and it has additionally invested KRW 300 billion.